Method for manufacturing printed circuit board
US9107311B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 8, 2013 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Nov 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.