Method for fabricating blackened conductive patterns
US9107317B2 · kind B2 · utility
1Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2008 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Jan 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.