Circuit module and method of manufacturing the same

US9107324B2 · kind B2 · utility

Assignee

• GE Embedded Electronics Oy · FI

Inventors

• Petteri Palm · Regensburg, DE
• Risto Tuominen · Espoo, FI
• Antti Iihola · Helsinki, FI

Key dates

• Filing date: Apr 1, 2014
• Grant date: Aug 11, 2015
• Expiry date: Apr 1, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4913
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (ACONT 1), between the intermediate layer and the contact area is less that the surface area (APAD) of the contact area.