Dual-frequency ultrasound transducer
US9108221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2010 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Jun 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A dual-frequency ultrasound transducer, comprising a piezo-electric element bonded to a substrate, has two resonant vibration modes: a low frequency mechanical bending resonance mode and a relatively high frequency thickness resonance mode. The low frequency bending resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a low frequency oscillating component. The high frequency thickness resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a relatively high frequency oscillating component. The transducer may include a mounting arrangement, such as a support ring securing the periphery of the substrate to an underlying base layer that enhances the depth of penetration and focus of the ultrasound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.