Disposable apparatus for aligning and dispensing solder columns in an array
US9108262B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2014 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Aug 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus is comprised of a carrier plate with a pattern of holes that is covered by a layer of sacrificial adhesive tape with sufficient tackiness to retain, position and hold an array of solder columns, et al. Alignment features on the bottom of the carrier plate plugs into a jig alignment fixture that precisely positions the solder columns, et al. over a CGA substrate. After peeling away the sacrificial adhesive tape from the apparatus, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.