Patent · US Active

Methods of manufacturing large-area sputtering targets using interlocking joints

US9108273B2 · kind B2 · utility

0Cited by
193References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 27, 2012
Grant dateAug 18, 2015
Priority date
Expiry dateJun 18, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/10
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.