System for real time monitoring for defects in an object during three-dimensional printing using a terahertz sensor
US9108358B1 · kind B1 · utility
23Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2014 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Apr 10, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14104
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus detects defects in an object during three-dimensional printing of the object. The apparatus uses a terahertz sensor to generate data corresponding to the thickness of an object being formed at a plurality of locations on the surface of a layer of the object. These thickness data are compared to thickness data for locations of the corresponding layer from a previous build of the object. If a difference in thickness exceeds a predetermined threshold, a defect is detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.