Patent · US Active

Microgravity fabrication and metalization of large, lightweight polymeric bubbles and films for space system applications

US9108370B2 · kind B2 · utility

0Cited by
7References
15Claims
0Family size

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Key dates

Filing dateOct 18, 2012
Grant dateAug 18, 2015
Priority date
Expiry dateFeb 21, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/1355
  • WIPO fieldTransport
  • WIPO sectorMechanical engineering

Abstract

A method of forming a metalized polymeric bubble in a space, microgravity environment is described. A liquid polymer bubble having a predetermined diameter is formed from a mixture comprising a liquid polymer and at least one of a UV curing material, a stabilizer, a UV absorber, or a surfactant. The liquid polymer bubble is cured with radiation to form a rigid polymer bubble. The rigid polymer bubble is then metalized with a metal to form the metalized polymeric bubble.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.