Method for producing silicon wafers, and silicon solar cell
US9109302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2011 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Sep 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In order to produce silicon wafers, liquid ultra-pure silicon is solidified on a silicon monocrystalline seed arranged in the bottom area of a crucible and having a seed surface comprising a {110}-crystal orientation and an edge surface having a {100}-crystal orientation starting from the bottom of the crucible, thus forming a silicon block on the seed surface of the silicon monocrystalline seed which largely takes over the {110}-crystal orientation. Subsequently, the silicon block is divided into wafers with a wafer surface having a {100}-crystal orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.