Touch sensing device and a method of fabricating the same using bonding marks on non-bonding surface of FPCB
US9111706B2 · kind B2 · utility
5Cited by
25References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2012 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Mar 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a touch sensing device and a method for fabricating the same. The touch sensing device comprises a touch panel and a flexible printed circuit board, wherein the touch panel comprises a first bonding mark and the flexible printed circuit board has a bonding surface bonded to the touch panel and has a non-bonding surface. The flexible printed circuit board comprises a second bonding mark disposed on the non-bonding surface. The second bonding mark and the first bonding mark have a relationship of contraposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.