Arrangement of two substrates having an SLID bond and method for producing such an arrangement
US9111787B2 · kind B2 · utility
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26References
14Claims
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Key dates
| Filing date | Oct 19, 2009 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Feb 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.