Semiconductor device and method for manufacturing semiconductor device
US9111819B2 · kind B2 · utility
3Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2014 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Dec 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.