Semiconductor device
US9111920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2013 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Aug 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a die pad comprised of a metal, and having at least one cutout portion in its peripheral edge portion, and a protruding portion formed by the cutout portion so as to protrude laterally from the peripheral edge portion; an inner lead having at its end a bonding pad that is placed in the cutout portion with an interval between the bonding pad and the die pad; a semiconductor chip held on the die pad so that a center position of the semiconductor chip is located on the protruding portion side with respect to a center position of the die pad; and a wire configured to electrically connect the semiconductor chip to the bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.