Method for producing at least one optoelectronic semiconductor component

US9112127B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Berthold Hahn · Hemau, DE
• Andreas Leber · Regensburg, DE

Key dates

• Filing date: Mar 2, 2012
• Grant date: Aug 18, 2015
• Expiry date: Apr 15, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

A method can be used to provide at least one optoelectronic semiconductor component, A carrier includes a first surface and a second surface opposite the first surface. At least one optoelectronic semiconductor chip is arranged on the first surface of the carrier. The optoelectronic semiconductor chip is formed with at least one n-side region and at least one p-side region, and is applied with the n-side region or the p-side region to the first surface. An electrically insulating enclosure is arranged on exposed points of the outer faces of the semiconductor chip and of the first surface of the carrier. The electrically insulating enclosure is partially removed. After removal at least one major face, remote from the carrier, of the optoelectronic semiconductor chip is free of the electrically insulating enclosure at least in places.