Method for producing an optoelectronic component, and optoelectronic component

US9112165B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventor

• Richard Baisl · Regensburg, DE

Key dates

• Filing date: Nov 20, 2012
• Grant date: Aug 18, 2015
• Expiry date: Nov 20, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A method for producing an optoelectronic component may include forming a first electrode on a substrate, forming an organic functional layer structure on the first electrode; forming a second electrode on the organic functional layer structure, forming at least one contact for making contact with the first and/or second electrode, forming an encapsulation layer above the layer structure and the contact, removing the encapsulation layer above the contact with the aid of an anisotropic etching method, and cooling the substrate during the anisotropic etching method.