Method for processing printed circuit board, printed circuit board and electronic apparatus
US9113565B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2012 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Jun 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB), a method for processing PCB and an electronic apparatus. The method for processing PCB may comprise: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has a geoelectric layer thereon; and the metal matrix is fixed in a slot provided in the substrate, the formed hole contacts both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the geoelectric layer and the metal matrix are in conduction with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.