Device for bonding flexible PCB to camera module
US9113586B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 22, 2013 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Apr 3, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a device for bonding a flexible PCB (Printed Circuit Board) to a camera module, the device according to an exemplary embodiment of the present disclosure comprising a thermo-compression unit configured to bond the camera module to the flexible PCB using an conductive film by applying heat and pressure to the conductive film between the camera module and the flexible PCB, an ultrasonic wave bonding unit configured to directly transmit ultrasonic wave vibration energy to the camera module to remove an oxide film on connection particles intrinsically formed inside the conducive film, and a controller configured to activate the ultrasonic wave bonding unit when a temperature of the conductive film rises to a predetermined temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.