Panel assembly with interstitial copper
US9113634B1 · kind B1 · utility
2Cited by
34References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Aug 27, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/16
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a panel assembly comprising a plurality of panels arranged in edge-to-edge format having joints between each pair of adjacent panels in the assembly. A copper-containing material, such as copper tape with adhesive backing, is provided in or near the joints in the assembly to render the joints less susceptible to bacterial contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.