Multiplexed electrospray cooling
US9114413B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jun 17, 2010 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Nov 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention is directed to a multiplexed system for electrospraying cooling fluid to produce electrically charged droplets essentially uniform in size for cooling applications. The system comprise a preferably microfabricated fluid distributor consisting of multiple nozzles/atomizers from which the droplets are dispersed, an extractor electrode consisting in an electrically conductive plate with multiple holes coaxial with the nozzles and a third electrode consisting of either the surface to be cooled or another conductive material in contact with said surface. The system provides highly efficient cooling by avoiding the droplet rebound, when the charged droplets are pinned on the surface to be cooled by the electric image force. Testing of a prototype system demonstrated a heat flux removal of 96 W/cm2 with a remarkable cooling efficiency reaching 97%. Applications of the invention pertain to the effective removal of high heat flux from microelectronic chips or similar devices with cooling requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.