Method of smoothing and/or bevelling an edge of a substrate
US9114467B2 · kind B2 · utility
0Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2010 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Feb 22, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method of smoothing and/or bevelling an edge of a substrate. The present invention also relates to a substrate produced by the method according to the present invention, in particular a substrate having an edge smoothed and/or bevelled by the method according to the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.