Laser based processing of layered materials
US9114482B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Jun 29, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.