Method and device for producing three-dimensional objects using laser technology and for applying an absorber using an ink jet method

US9114567B2 · kind B2 · utility

Assignee

• EVONIK DEGUSSA GMBH · DE

Inventors

• Sylvia Monsheimer · Haltern am See, DE
• Maik Grebe · Bochum, DE
• Rainer Goering · Borken, DE
• Franz-Erich Baumann · Schneverdingen, DE

Key dates

• Filing date: Jan 27, 2005
• Grant date: Aug 25, 2015
• Expiry date: Mar 24, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P10/25
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

The present invention relates to a process for the bonding of material for the production of three-dimensional objects by selective heating via a laser of wavelength from 100 to 3000 nm. The beam spot may be a focused or unfocused beam spot, or may indeed be spread, as is the case with the diode laser, where the bars may have a stacked arrangement. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by laser radiation of wavelength from 100 to 3000 nm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding.