Patent · US Active

Deposition and selective removal of conducting helplayer for nanostructure processing

US9114993B2 · kind B2 · utility

1Cited by
31References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 18, 2014
Grant dateAug 25, 2015
Priority date
Expiry dateSep 18, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for making one or more nanostructures is disclosed, the method comprising: depositing a conducting layer on an upper surface of a substrate; depositing a patterned layer of catalyst on the conducting layer; growing the one or more nanostructures on the layer of catalyst; and selectively removing the conducting layer between and around the one or more nanostructures. A device is also disclosed, comprising a substrate, wherein the substrate comprises one or more exposed metal islands separated by one or more insulating areas; a conducting helplayer disposed on the substrate covering at least some of the one or more exposed metal islands or insulating areas; a catalyst layer disposed on the conducting helplayer; and one or more nanostructures disposed on the catalyst layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.