Flexible IC/microfluidic integration and packaging

US9116145B2 · kind B2 · utility

Assignee

• The George Washington University · US

Inventors

• Zhenyu Li · Longbeilingcun, CN
• Mona Zaghloul · Bethesda, US
• Bowei Zhang · Fremont, US
• Can E. Korman · McLean, US

Key dates

• Filing date: Dec 14, 2012
• Grant date: Aug 25, 2015
• Expiry date: Dec 14, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49155
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).