Midplane for orthogonal direct connection
US9116660B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Jul 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1445
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A novel midplane is shaped with voids through which a dataplane connection is made between components on one side of the midplane and components on the opposite side of the midplane. The voids in the novel midplane offer numerous advantages in the design of network devices, including improved cooling performance, minimizing rack unit space and maximizing interface density, improved signal integrity allowing greater bandwidth through elimination of midplane signaling connections, improved upgradability of orthogonal direct connectors with little or no impact on the midplane or chassis, and proper alignment between the components of the dataplane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.