Patent · US Active

Redundant anode sputtering method and assembly

US9117637B2 · kind B2 · utility

0Cited by

9References

20Claims

0Family size

Assignee

VON ARDENNE GMBH · DE

Inventors

Goetz Teschner · Gelnhausen, DE
Falk Milde · Dresden, DE
Enno Mirring · Radeberg, DE
Frank Meissner · Hannover, DE
Goetz Grosser · Dresden, DE

Key dates

Filing date	Nov 6, 2006
Grant date	Aug 25, 2015
Priority date	—
Expiry date	Aug 6, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3438
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method is provided for coating a substrate with the aid of a magnetron cathode and two electrodes which are alternately impinged upon by a positive potential and a negative potential. Also disclosed is an assembly for coating a substrate, comprising a vacuum chamber, a magnetron cathode, two electrodes, and a voltage source. A negative potential is generated at a level that is no greater than the level of the cathode potential, thus preventing the electrode that is to be cleaned from being stripped to a greater extent than the same was coated in the previous half-wave. The magnetron cathode and the electrodes are connected to the voltage source via switching elements without being galvanically such that a negative and a positive voltage generated from the voltage source can be alternatively applied to the electrodes, the level of said voltage being no greater than the cathode voltage.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.