Process for manufacturing a semiconductor device and an intermediate product for the manufacture of a semiconductor device
US9117753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2012 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Jun 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the inventive concept there is provided a process for manufacturing a semiconductor device, comprising: providing a channel layer (104), providing a mask (106) on the channel layer, epitaxially growing a contact layer (108) in contact with the channel layer, epitaxially growing a support layer (110) on the contact layer, wherein the support layer is arranged to be etched at a higher rate than the contact layer, forming a trench extending through the support layer by removing the mask, and providing a conductor (118) in the trench. There is also provided an intermediate product for the manufacture of a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.