Heat sink device and method of repairing semiconductor device
US9117788B2 · kind B2 · utility
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1Claims
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Key dates
| Filing date | Jul 18, 2011 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Jan 10, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.