Patent · US Active

Method of controlling the amount of Cu doping when forming a back contact of a photovoltaic cell

US9117956B2 · kind B2 · utility

1Cited by
2References
19Claims
0Family size

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Key dates

Filing dateAug 31, 2012
Grant dateAug 25, 2015
Priority date
Expiry dateSep 24, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50

Abstract

Methods for preparing an exposed surface of a p-type absorber layer of a p-n junction for coupling to a back contact in the manufacture of a thin film photovoltaic device are provided. The method can include: applying a treatment solution onto the exposed surface defined by the p-type absorber layer of cadmium telluride; and annealing the device with the p-type absorber layer in contact with the treatment solution to form a tellurium-enriched region in the p-type absorber layer at the exposed surface. The treatment solution comprises a chlorinated compound component that is substantially free from copper, a copper-containing metal salt, and a solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.