Balun circuit using a defected ground structure
US9118099B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2012 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Dec 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed is a balun circuit using defected ground structure. The balun circuit using a defected ground structure includes: a substrate; a ground surface formed on one surface of the substrate, the ground surface being formed with defect structure in a previously set shape; and two transmission lines formed on the other surface of the substrate opposing the ground surface, and separated from each other, and the defect structure of the ground surface is configured to have open circuit impedance characteristics, and one of the two transmission lines is grounded. An even mode signal is removed by using the defect ground structure having the open circuit impedance characteristics, and termination of total reflection characteristics is performed by using the grounding of one of the transmission lines. Accordingly, a balun circuit can be obtained which is small in size, has little loss at high frequency, and shows little change in characteristics due to the process error.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.