Bonding wire impedance matching circuit
US9118301B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Dec 17, 2012 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Oct 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/028
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An impedance matching circuit is provided. The present impedance matching circuit is able to match impedance using a transformer which is arranged inside a dielectric substrate and arranged to overlap with a bonding pad area and an end of a transmission line, thereby enabling transmitting signals at a desired frequency with a minimum insertion loss without using a very thin transmission line which is several to dozens of μm wide or specially designed antennas in order to compensate for inductance. Thus, the present impedance matching circuit may be applied to various millimeter bands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.