Camera system with multiple pixel arrays on a chip
US9118850B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2008 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Nov 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/78
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera system uses one or more image sensor IC chips each having multiple pixel arrays on the same semiconductor substrate (i.e., “multiple pixel arrays on a chip”). In one embodiment, such a camera system includes: (a) optical components that create multiple images in close physical proximity of each other (e.g., within a few millimeters or centimeters); and (b) a single sensor substrate (“chip”) containing multiple 2-dimensional pixel arrays that are aligned to capture these multiple images, so as to convert the multiple images into electrical signal. The pixel arrays can be manufactured using a CCD or a CMOS compatible process. For manufacturing reasons, such a chip is typically two centimeters or less on a side. However, large chips can also be made. Optional electronic components for further signal processing of the captured images may be formed either on the sensor chip (i.e., in a “system-on-a-chip” implementation), or in a separate back-end application specific integrated circuit (ASIC). In addition, digital storage components, display elements, and wired or wireless communication links may also be included in any suitable combination to allow review and further processin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.