Housing for a portable electronic device
US9119307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2012 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Apr 7, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An injection molded housing for a portable electronic device is provided. The housing contains a thermoplastic composition that includes a polyarylene sulfide melt processed in the presence of a disulfide compound and a filler. Without intending to be limited by theory, it is believed that the disulfide can undergo a chain scission reaction with the starting polyarylene sulfide to lower its melt viscosity, which can lead to decreased attrition of the filler and thus improved mechanical properties. Due to this ability to reduce viscosity during melt processing, the present inventors have discovered that relatively high molecular weight polyarylene sulfides can be fed to the extruder with little difficulty.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.