System in package assembly
US9119320B2 · kind B2 · utility
0Cited by
8References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2013 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Oct 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.