Bonding structure manufacturing method, heating and melting treatment method, and system therefor
US9119336B2 · kind B2 · utility
4Cited by
17References
5Claims
0Family size
Assignee
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Key dates
| Filing date | May 12, 2014 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | May 12, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.