Singulation of layered materials using selectively variable laser output

US9120181B2 · kind B2 · utility

Assignee

• Coherent, Inc. · US

Inventors

• Ramanujapuram A. Srinivas · San Jose, US
• Michael Greenberg · Santa Rosa, US
• David M. Gaudiosi · Abdulrahman Khaleefah Street, US
• Michael Mielke · Orlando, US
• Tim Booth · Penngrove, US

Key dates

• Filing date: Sep 16, 2011
• Grant date: Sep 1, 2015
• Expiry date: Dec 6, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2103/172
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.