Methods of manufacturing large-area sputtering targets
US9120183B2 · kind B2 · utility
0Cited by
194References
23Claims
0Family size
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Key dates
| Filing date | Sep 27, 2012 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Nov 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.