Device for encapsulating a component with plastics material
US9120258B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2012 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | May 24, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/14639
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a device (10; 10a) for encapsulating a component (1) with plastic material (2), comprising at least two tool parts (11, 12), which in a closed arrangement for encapsulating the component (1) form a receptacle (15) for the component (1), an injection channel (30) for supplying the liquefied plastic material (2) to the region of the receptacle (15), and a single retaining element (22) for positioning the component (1) in the receptacle (15), wherein the retaining element (22) can be moved in a first position for positioning the component (1) in the receptacle (15) and in a second position for preferably completely encapsulating the component (1) with the plastic material (2). According to the invention, the retaining element (22) holds the component (1) in the region of the receptacle (15) by means of form positive and/or clamping engagement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.