Method and device using a ceramic bond material for bonding metallic interconnect to ceramic electrode
US9120683B2 · kind B2 · utility
1Cited by
1References
20Claims
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Key dates
| Filing date | Feb 8, 2010 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Feb 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electrochemical device includes a ceramic electrode, a metallic interconnect, and a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together. The ceramic material includes manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.