Copper particulate dispersion, conductive film forming method and circuit board
US9120944B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 4, 2012 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Jan 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0514
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An object is to provide a copper particulate dispersion which is suited to discharge in the form of droplets.The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle having a boiling point within a range from 150° C. to 250° C. Whereby, when the copper particulate dispersion is discharged in the form of droplets, clogging at the discharge portion caused by drying of the dispersion vehicle is prevented and the viscosity is low for its high boiling point, and thus the copper particulate dispersion is suited to discharge in the form of droplets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.