Method to control the temperature of a high powered computing component through a liquid cooled heatsink responsive to an increase in the thermal value
US9122737B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Nov 16, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3062
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.