Methods and applications of non-planar imaging arrays
US9123614B2 · kind B2 · utility
48Cited by
46References
29Claims
0Family size
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Key dates
| Filing date | Jan 23, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Jan 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.