Active matrix substrate
US9123679B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2011 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Dec 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active matrix substrate includes a substrate and an insulating unit arranged on the substrate. The substrate includes a display region and a periphery circuit region beside the display region. The periphery circuit region has at least a chip connecting unit. Each chip connecting unit includes a number of connecting elements. Each of the connecting elements includes a conducting pad and a wire electrically connected to the conducting pad. The conducting pads of the connecting elements are arranged in at least two rows. The insulating unit has a number of contact holes corresponding to the conducting pads so that each of the conducting pads is entirely exposed by the corresponding contact hole. The active matrix substrate is applied to a display device to increase reliability of the display device and improve the quality of the display device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.