Systems and methods for forming contact definitions
US9123690B1 · kind B1 · utility
1Cited by
11References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Oct 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In one embodiment, an electrical circuit formed on a substrate includes a first multi-layer stack and a second multi-layer stack that share a top layer that comprises a continuous piece of conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.