Semiconductor device having a semiconductor chip and wiring
US9123710B2 · kind B2 · utility
1Cited by
3References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Apr 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes at least one semiconductor chip, a first lead, and a second lead. The first lead includes a first portion connected to the semiconductor chip via a first wiring. The second lead includes a first portion connected to the semiconductor chip via a second wiring. The first portion of the first lead and the first portion of the second lead extend along a first direction. The first portion of the first lead is disposed so as to oppose the first portion of the second lead. The semiconductor chip is disposed between the first portion of the first lead and the first portion of the second lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.