Dicing die bond film
US9123794B2 · kind B2 · utility
6Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Nov 5, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2817
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10−6 Ω·cm or more and 1×10−3 Ω·cm or less, and the tensile storage modulus of the thermosetting type die bond film at −20° C. before thermal curing is 0.1 to 10 GPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.