Module-level processing of silicon photovoltaic cells
US9123859B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 8, 2014 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Sep 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
A method for module-level processing of photovoltaic cells is provided. The method includes: bonding at least one crystalline silicon photovoltaic substrate to a carrier by means of an adhesive layer, thereby leaving part of the adhesive layer uncovered; after bonding, exposing the uncovered part of the adhesive layer and the at least one crystalline silicon photovoltaic substrate to a plasma; and removing a surface portion of the at least one crystalline photovoltaic substrate. The method may further include performing an annealing step of the adhesive before bonding the at least one photovoltaic substrate to the carrier, and performing an outgassing step of the adhesive after bonding the at least one photovoltaic substrate to the carrier. The method may further include module-level rear side processing of the at least one crystalline silicon photovoltaic substrate to make a photovoltaic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.