Cooling for electronic components
US9125299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2012 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Dec 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.