Method for embedding thin film sensor in a material
US9126271B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2008 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Oct 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process or through a dynamic bonding process. The embedded sensor or other desired device is provided on a substrate through any known or later-developed method. A cover is then bonded to the substrate using a solid-state bonding process or a dynamic bonding process. The solid-state bonding process may include providing heat and pressure to the substrate and the cover to bond the substrate and the cover together. The dynamic bonding process may include heating a bonding agent and distributing the heated bonding agent between the substrate and cover to bond the substrate and the cover together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.