Patent · US Active

Method for a fluid-tight connection of two components for producing a fluid-tight cooling unit

US9126282B2 · kind B2 · utility

0Cited by
5References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 9, 2012
Grant dateSep 8, 2015
Priority date
Expiry dateFeb 28, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49393
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for connecting two components in a fluid-tight manner for producing a fluid-tight unit is provided. The method includes a step of providing at least one first component that is solder-plated on one side, wherein the first component has a cutting burr on a side facing away from the solder-plated surface. The method further includes a step of connecting, in particular soldering, the first component to a second component in a fluid-tight manner, in order to produce the fluid-tight unit, wherein the solder-plated surface of the first component faces the second component when connecting the first and second components in a fluid-tight manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.