Method for a fluid-tight connection of two components for producing a fluid-tight cooling unit
US9126282B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Feb 28, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for connecting two components in a fluid-tight manner for producing a fluid-tight unit is provided. The method includes a step of providing at least one first component that is solder-plated on one side, wherein the first component has a cutting burr on a side facing away from the solder-plated surface. The method further includes a step of connecting, in particular soldering, the first component to a second component in a fluid-tight manner, in order to produce the fluid-tight unit, wherein the solder-plated surface of the first component faces the second component when connecting the first and second components in a fluid-tight manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.